Intel’s fourth-generation Xeon Sapphire Rapids processor confirmed: equipped with HBM memory, multi-chip package

On October 17th, according to foreign media TomsHardware, Intel recently confirmed the fourth-generation Xeon “Sapphire Rapids” server processor. The actual photo of this processor was exposed by an engineer @wassickt, who said that the photo of the processor came from the Intel IMAPS 2021 slideshow.

As can be seen from the figure, the processor encapsulates four CCD cores, and each core is equipped with two rectangular HBM memory chips. The whistleblower said that this may be HBM2E video memory. Each processor core will have two 1024-bit memory buses. According to the HBM2E memory specification, its maximum transmission rate is 3.2GT/s, but SK Hynix has mass-produced a 16GB HBM chip with a speed of 3.6GT/s.

According to calculations, if Intel uses the latest HBM2E memory, the total processor memory bandwidth can reach 3.68TB/s (or 921.6GB/s per chip).

IT Home understands that Intel’s next-generation Sapphire Rapids processor will also be connected to the motherboard by BGA and soldered directly on the motherboard. Foreign media said that because the processor integrates too many chips and the distance from the edge of the substrate is very narrow, it has to be installed in this way and cannot be equipped with a traditional upper cover. According to previous reports, this processor will have up to 56 cores, support 8-channel DDR5 memory, and TDP 350W.

In addition, this processor will also support PCIe 5.0, channel, support CXL 1.1, support Intel AMX function and AVX512_BF16, AVX512_VP2INTERSECT instruction set. The product will also support DSA data stream acceleration technology to meet the needs of professional data centers.